Iindidi zee-LEDs ezincinci ze-pitch zonyukile, kwaye sele beqalisile ukukhuphisana ne-DLP kunye neLCD kwintengiso yangaphakathi. Ngokwedatha kwisikali semakethi yokubonisa i-LED kwihlabathi liphela, ukusuka ngo-2018 ukuya ku-2022, izibonelelo zomsebenzi weemveliso zokubonisa ezincinci ze-LED ziya kubonakala, zisenza imeko yokutshintsha ubuchwepheshe be-LCD kunye ne-DLP.
Ukuhanjiswa kwemizi mveliso yabathengi abancinci be-LED
Kwiminyaka yakutshanje, ii-LEDs ezincinci ze-pitch ziye zafezekisa ukukhula ngokukhawuleza, kodwa ngenxa yeendleko kunye nemicimbi yezobuchwephesha, ngoku zisetyenziselwa ubukhulu becala kwimimandla yokubonisa. La mashishini awathathi ntweni kumaxabiso emveliso, kodwa afuna umgangatho ophezulu wokubonisa, ngenxa yoko bahlala kwimarike kwicandelo lemiboniso ekhethekileyo.
Ukuphuhliswa kwee-LEDs ezincinci ze-pitch ukusuka kwintengiso ezinikezelweyo kwiimarike zorhwebo nezoluntu. Emva kwe-2018, njengoko iteknoloji ikhula kwaye iindleko zincipha, ii-LEDs ezincinci ziye zaqhuma kwiimarike zokubonisa ezinje ngamagumbi eenkomfa, ezemfundo, iindawo zokuthenga, kunye neqonga lemidlalo bhanyabhanya. Ibango le-LEDs ezisezantsi eziphezulu kwiimarike zaphesheya ziyakhawuleza. Isixhenxe sabavelisi abaphambili be-LED abasibhozo bavela eTshayina, kwaye abavelisi abaphezulu abasibhozo benza i-50.2% yesabelo sentengiso sehlabathi. Ndiyakholelwa ukuba njengokuba ubhubhane wesithsaba uzinzile, iimarike zaphesheya kwezilwandle kungekudala zizakuqala.
Thelekisa i-LED encinci ye-pitch, i-Mini Mini kunye neMicrosoft LED
Ezi teknoloji zintathu zingasentla ziboniswa kumazibuko amancinci e-LED njengamaphikseli amanqaku akhanyayo, umahluko ulele kumgama phakathi kweentsimbi zezibane ezikufutshane kunye nobukhulu be-chip. I-Mini LED kunye neMicro LED ziyaqhubeka ukunciphisa ubungakanani besibane kunye nesayizi ye-chip kwisiseko se-LEDs ezincinci, ezizezona zihamba phambili kunye nolwalathiso lophuhliso lwetekhnoloji yexesha elizayo.
Ngenxa yomahluko kubungakanani be-chip, iinkalo ezahlukeneyo zesicelo sobuchwephesha ziya kwahluka, kunye ne-pixel encinci yomgama ithetha umgama wokubukela kufutshane.
Uhlalutyo lweTekhnoloji encinci yokuPakisha ye-LED
I-SMDsisifinyezo sesixhobo sokunyuka umphezulu. I-chip engenanto igxunyekwe kubakaki, kwaye uqhagamshelo lombane lwenziwa phakathi kwee-electrode ezilungileyo nezingalunganga ngocingo lwentsimbi. I-epoxy resin isetyenziselwa ukukhusela ubuhlalu bezibane ze-SMD ze-LED. Isibane se-LED senziwe nge-soldering. Emva kokuba amaso adityaniswe ngePCB ukwenza imodyuli yeyunithi yokubonisa, imodyuli ifakiwe kwibhokisi emiselweyo, kwaye unikezelo lwamandla, ikhadi lolawulo kunye nocingo kuyongezwa ukwenza isikrini esibonisa i-LED.
Xa kuthelekiswa nezinye iimeko zokupakisha, izibonelelo zeemveliso ezipakishwe nge-SMD zingaphezulu kokungalunganga, kwaye ziyahambelana neempawu zorhwebo lwasekhaya (ukwenza izigqibo, ukuthengwa, kunye nokusetyenziswa). Kwakhona ziimveliso eziqhelekileyo kwishishini kwaye banokufumana ngokukhawuleza iimpendulo zenkonzo.
I-COBInkqubo kukubambelela ngokuthe ngqo kwi-chip ye-LED kwi-PCB ngegluji eqhubayo okanye engahambisiyo, kunye nokwenza intambo yocingo ukufezekisa uqhagamshelo lombane (inkqubo elungileyo yokufaka) okanye ukusebenzisa itekhnoloji ye-chip flip-chip (ngaphandle kweengcingo zentsimbi) ukwenza okuhle nokubi ii-electrode zesibane sesibane esidityaniswe ngokuthe ngqo kunxibelelwano lwePCB (itekhnoloji yeflip-chip), kwaye ekugqibeleni imodyuli yeyunithi yokubonisa iyenziwa, kwaye imodyuli ifakiwe kwibhokisi emiselweyo, ngombane, ikhadi lokulawula kunye nocingo, njl. yenza isikrini esibonisiweyo se-LED. Uncedo lwetekhnoloji ye-COB kukuba yenza lula inkqubo yemveliso, kunciphisa iindleko zemveliso, kunciphisa ukusetyenziswa kwamandla, ke ubushushu bomgangatho wokubonisa buyancitshiswa, kwaye umahluko uphuculwe kakhulu. Ukungancedi kukuba ukuthembeka kujongene nemiceli mngeni emikhulu, kunzima ukulungisa isibane, kwaye ukuqaqamba, umbala, kunye nombala weinki kusenzima ukwenza ukungqinelana.
IMDidibanisa amaqela angama-R eerb ze-RGB kwiyunithi encinci ukwenza ibhondi yesibane. Eyona ndlela iphambili yobuchwephesha: I-Yang yesi-4 ngo-1, i-Common Yin 2 ngo-1, i-Common Yin 4 ngo-1, i-Common Yin ngo-6 ngo-1, njl. Ubungakanani be-bead ubukhulu bukhulu, ukuphakama komhlaba kulula, kwaye i-pitch encinci ye-dot ingafezekiswa, eyanciphisa ubunzima bokugcinwa. Ukungancedi kwayo kukuba ikhonkco langoku lezemveliso aligqibekanga, ixabiso liphezulu, kwaye ukuthembeka kujongene nemiceli mngeni emikhulu. Ulondolozo alulunganga, kwaye ukungaguquguquki kokuqaqamba, umbala, kunye ne-inki ayikhange isonjululwe kwaye ifuna ukuphuculwa ngakumbi.
I-LED encincikukuhambisa isixa esikhulu sedilesi ukusuka kulungelelwaniso lwendabuko lwe-LED kunye nokwenza izinto ezincinci kwi-substrate yesekethe ukwenza ii-LEDs ze-ultra-fine-pitch. Ubude be-millimeter-level ye-LED buye bancitshiswa kwinqanaba le-micron ukufezekisa iipikseli ze-ultra-high kunye nesisombululo se-ultra-high. Kwithiyori, inokuhlengahlengiswa kubungakanani obahlukeneyo bescreen. Okwangoku, itekhnoloji ephambili kwibhotile ye-Micro LED kukugqobhoza iteknoloji yenkqubo ye-miniaturization kunye netekhnoloji yokuhambisa ubuninzi. Okwesibini, itekhnoloji yokuhambisa ifilimu encinci inokuqhekeza umda wobungakanani kwaye igqibe ukuhambisa ibhetshi, ekulindeleke ukuba icuthe iindleko.
I-GOBItekhnoloji yokugubungela bonke ubuso beemodyuli zokunyuka komhlaba. Iquka umaleko wecolloid ongafihliyo kumphezulu weemodyuli ze-SMD ezincinci zokucombulula ingxaki yemilo eyomeleleyo kunye nokhuseleko. Eyona nto ibalulekileyo, iseyimveliso encinci ye-SMD. Uncedo lwayo kukunciphisa izibane ezifileyo. Iyonyusa amandla okhuselo kunye nokukhuselwa komphezulu weentsimbi zezibane. Ukungancedi kwayo kukuba kunzima ukulungisa isibane, ukushenxiswa kwemodyuli ebangelwa luxinzelelo lwe-colloidal, ukubonakalisa, ukugcwala kwendawo, ukubala kombala, kunye nokulungiswa okunzima kwe-welding ebonakalayo.
Ixesha Post: Jun-16-2021