Iindidi ze-LED ezincinci ziye zanda, kwaye ziye zaqala ukukhuphisana ne-DLP kunye ne-LCD kwimarike yokubonisa yangaphakathi. Ngokutsho kwedatha kwisikali semakethe ye-LED yehlabathi jikelele, ukusuka kwi-2018 ukuya kwi-2022, izibonelelo zokusebenza zeemveliso ze-LED ze-pitch ezincinci ziya kubonakala, zenze umkhwa wokutshintsha i-LCD yendabuko kunye ne-DLP teknoloji.
Ukuhanjiswa kweshishini labathengi be-LED abancinci
Kwiminyaka yakutshanje, ii-LED ezincinci zifumene uphuhliso olukhawulezayo, kodwa ngenxa yeendleko kunye nemiba yobugcisa, okwangoku zisetyenziswa kakhulu kwiinkalo zokubonisa ubuchwephesha. La mashishini akakhathali kumaxabiso emveliso, kodwa afuna umgangatho ophakamileyo wokubonisa, ngoko ke ahlala ngokukhawuleza kwimarike kwibala lemiboniso ekhethekileyo.
Uphuhliso lwee-LED ezinomgangatho omncinci ukusuka kwintengiso ezinikeleyo yokubonisa ukuya kwiimarike zorhwebo nezoluntu. Emva kwe-2018, njengoko iteknoloji ikhula kwaye iindleko ziyancipha, ii-LED ezincinci ziye zaqhuma kwiimarike zokubonisa zorhwebo ezifana namagumbi eenkomfa, imfundo, iivenkile zokuthenga, kunye nemiboniso bhanyabhanya. Imfuno ephezulu yee-LED ezincinci kwiimarike zaphesheya ziyakhawuleza. Abasixhenxe kwabasibhozo abaphezulu behlabathi abavelisi be-LED baphuma e-China, kwaye abavelisi abasibhozo abaphezulu benza i-50.2% yesabelo semarike yehlabathi. Ndiyakholelwa ukuba njengoko ubhubhani omtsha uzinza, iimarike zaphesheya ziya kukhula kungekudala.
Ukuthelekiswa kwe-LED encinci, i-Mini LED, kunye ne-Micro LED
Ezi tekhnoloji zintathu zokubonisa zingentla zonke zisekwe kumasuntswana ekristale e-LED njengendawo ekhanyayo ye-pixel, umahluko ukude phakathi kwamaso wesibane akufutshane kunye nobukhulu betshiphu. I-Mini LED kunye ne-Micro LED ziphinda zinciphise izithuba zesibane kunye nobukhulu be-chip ngokwesiseko se-LED-pitch encinci, eyona ndlela iphambili kunye nomkhombandlela wophuhliso wobuchwephesha bexesha elizayo.
Ngenxa yomahluko kubungakanani betshiphu, iindawo ezahlukeneyo zokusebenzisa itekhnoloji yokubonisa ziya kwahluka, kwaye iphikseli encinci inowuthi ithetha umgama okufutshane wokujonga.
Uhlalutyo lweTekhnoloji yokuPakisha i-LED encinci yePitch
SMDsisishunqulelo sesixhobo sokunyuka komphezulu. I-chip engenanto igxininiswe kwi-bracket, kwaye uxhumano lombane lwenziwa phakathi kwe-electrode efanelekileyo kunye ne-negative ngokusebenzisa ucingo lwensimbi. I-epoxy resin isetyenziselwa ukukhusela iintsimbi zesibane se-SMD LED. Isibane se-LED senziwe ngokuphinda kufakwe i-soldering. Emva kokuba amaso adityaniswe kunye ne-PCB ukwenza imodyuli yeyunithi yokubonisa, imodyuli ifakwe kwibhokisi ehleliweyo, kunye nokunikezelwa kwamandla, ikhadi lokulawula kunye nocingo longezwa ukwenza isikrini se-LED esigqityiweyo.
Xa kuthelekiswa nezinye iimeko zokupakisha, iingenelo zeemveliso ezipakishweyo ze-SMD zigqwesa ukungonakali, kwaye zihambelana neempawu zemfuno yentengiso yasekhaya (ukwenza izigqibo, ukuthenga, kunye nokusetyenziswa). Zikwayimveliso eqhelekileyo kwishishini kwaye inokufumana ngokukhawuleza iimpendulo zenkonzo.
COBInkqubo kukubambelela ngokuthe ngqo kwi-chip ye-LED kwi-PCB kunye neglue eqhubayo okanye engaqhubekiyo, kwaye benze intambo yokudibanisa ukuphumeza uqhagamshelo lombane (inkqubo yokunyuswa okulungileyo) okanye ukusebenzisa iteknoloji ye-chip flip-chip (ngaphandle kweengcingo zetsimbi) ukwenza okulungileyo nokubi. i-electrodes ye-bead yesibane edityaniswe ngokuthe ngqo kwi-PCB yoxhulumaniso (iteknoloji ye-flip-chip), kwaye ekugqibeleni imodyuli yeyunithi yokubonisa yenziwe, kwaye imodyuli ifakwe kwibhokisi ehleliweyo, kunye nokunikezelwa kwamandla, ikhadi lokulawula kunye nocingo, njl. yenza isikrini se-LED esigqityiweyo. Inzuzo yetekhnoloji ye-COB kukuba yenza lula inkqubo yokuvelisa, inciphisa iindleko zemveliso, inciphise ukusetyenziswa kwamandla, ngoko ke ubushushu bomphezulu womboniso buyancipha, kwaye umahluko uphuculwe kakhulu. Ukungalungi kukuba ukuthembeka kujongene nemingeni emikhulu, kunzima ukulungisa isibane, kunye nokukhanya, umbala, kunye nombala we-inki kusenzima ukwenza Ukuhambelana.
IMDidibanisa amaqela e-N amaso esibane e-RGB abe yiyunithi encinane ukwenza intsimbi yesibane. Indlela yobugcisa obuphambili: I-Yang eqhelekileyo 4 kwi-1, i-Yin eqhelekileyo 2 kwi-1, i-Yin eqhelekileyo 4 kwi-1, i-Yin eqhelekileyo 6 kwi-1, njl. Ubungakanani bentsimbi yesibane bukhulu, ukunyuswa komphezulu kulula, kwaye i-pitch yechaphaza encinci inokufezekiswa, okunciphisa ubunzima bokugcinwa. Ukungalungi kwayo kukuba ikhonkco lamashishini langoku alifezekanga, ixabiso liphezulu, kwaye ukuthembeka kujongene nemingeni emikhulu. Ulondolozo alunangxaki, yaye ukuhambelana kokuqaqamba, umbala, nombala we-inki akukasonjululwanga yaye kufuneka kuphuculwe ngakumbi.
I-Micro LEDkukudlulisa isixa esikhulu seedilesi ukusuka kuluhlu lwemveli lwe-LED kunye ne-miniaturization ukuya kwi-substrate yesekethe ukwenza ii-LED ze-ultra-fine-pitch. Ubude benqanaba le-millimeter ye-LED buncitshiswe ngakumbi kwinqanaba le-micron ukufezekisa iipikseli ze-ultra-high kunye ne-ultra-high resolution. Ngokwethiyori, inokulungiswa kwiisayizi ezahlukeneyo zesikrini. Okwangoku, itekhnoloji ephambili kwi-bottleneck ye-Micro LED kukuqhekeza itekhnoloji yenkqubo ye-miniaturization kunye neteknoloji yokudlulisa ubunzima. Okwesibini, itekhnoloji yokudlulisa ifilimu encinci inokwephula umda wobungakanani kwaye igqibezele ukuhanjiswa kwebhetshi, ekulindeleke ukuba inciphise iindleko.
GOByitekhnoloji yokugubungela wonke umphezulu weemodyuli zokunyuka komphezulu. Ifakela umaleko we-colloid ecacileyo kumphezulu weemodyuli ze-SMD zendabuko ezincinci ukusombulula ingxaki yobume obuqinileyo kunye nokukhusela. Ngokwenyani, iseyimveliso ye-SMD encinci. Inzuzo yayo kukunciphisa izibane ezifileyo. Yandisa amandla okuchasa ukothuka kunye nokukhuselwa komphezulu wamaso wesibane. Ukungalungi kwayo kukuba kunzima ukulungisa isibane, ukuguqulwa kwemodyuli okubangelwa uxinzelelo lwe-colloidal, ukubonakalisa, i-degumming yendawo, i-colloidal discoloration, kunye nokulungiswa okunzima kwe-welding virtual.
Ixesha lokuposa: Jun-16-2021